Dovarish Vladimirowitch,
Black pad failure is a brittle separation.
Werner
-----Original Message-----
From: vladimir Igoshev <[log in to unmask]>
To: TechNet E-Mail Forum <[log in to unmask]>; Werner Engelmaier <[log in to unmask]>
Sent: Wed, Oct 27, 2010 10:41 am
Subject: Re: [TN] Cracks in BGA solderjoints
Werner,
Sorry but I could keep quiet. It;s not a Black pad, but Brittle fracture
Vladimir
SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca
-----Original Message-----
From: Werner Engelmaier <[log in to unmask]>
Sender: TechNet <[log in to unmask]>
Date: Wed, 27 Oct 2010 10:21:07
To: <[log in to unmask]>
Reply-To: TechNet E-Mail Forum <[log in to unmask]>,
Werner Engelmaier <[log in to unmask]>
Subject: Re: [TN] Cracks in BGA solderjoints
Hallo Günter,
Wie geht's?
The separation is classical 'ENIG 'Black Pad'—separation between Ni and IMC
layers with dark area being high P concentration; the micro-voids are not [these
voids do not look like Kirkendall voids].
I do not know what you mean be "cracks are somewhere in the width of the solder
joint"--I do not see any cracks in the solder, just those voids.
Werner
-----Original Message-----
From: Grossmann, Guenter <[log in to unmask]>
To: [log in to unmask]
Sent: Wed, Oct 27, 2010 3:36 am
Subject: [TN] Cracks in BGA solderjoints
Hi Technetters
I have an effect in BGA solder joints that I have never seen before.
In microsections and in FIB preparations I see cracks between the IMC and a
slightly darker region towards the Ni which I assume to be a P enriched zone of
the Ni. However, the cracks are somewhere in the width of the solder joint and
they are quite short running out to a row of pores that look somehow like
Kirkendall voids.
Is there still a possibility to place one or two pictures? Kim's IPC site
doesn't work.
Best regards
Günter
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