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October 2010

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Werner Engelmaier <[log in to unmask]>
Date:
Wed, 27 Oct 2010 10:21:07 -0400
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 Hallo Günter,
Wie geht's?
The separation is classical 'ENIG 'Black Pad'—separation between Ni and IMC layers with dark area being high P concentration; the micro-voids are not [these voids do not look like Kirkendall voids].

 I do not know what you mean be "cracks are somewhere in the width of the solder joint"--I do  not see any cracks in the solder, just those voids.
Werner


 

 

-----Original Message-----
From: Grossmann, Guenter <[log in to unmask]>
To: [log in to unmask]
Sent: Wed, Oct 27, 2010 3:36 am
Subject: [TN] Cracks in BGA solderjoints


Hi Technetters



I have an effect in BGA solder joints that I have never seen before.

In microsections and in FIB preparations I see cracks between the IMC and a 

slightly darker region towards the Ni which I assume to be a P enriched zone of 

the Ni. However, the cracks are somewhere in the width of the solder joint and 

they are quite short running out to a row of pores that look somehow like 

Kirkendall voids.

Is there still a possibility to place one or two pictures? Kim's IPC site 

doesn't work.



Best regards



Günter 







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