Production or field failures? Any other anomalies on others solder bumps. Is this a corner bump?
"X"
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Wednesday, October 27, 2010 6:26 AM
To: [log in to unmask]
Subject: Re: [TN] Cracks in BGA solderjoints
Spalling of the IMC? Are those reworked?
--------------------------
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----- Original Message -----
From: Inge [mailto:[log in to unmask]]
Sent: Wednesday, October 27, 2010 07:17 AM
To: [log in to unmask] <[log in to unmask]>
Subject: Re: [TN] Cracks in BGA solderjoints
I think it's not cracks in the BGA, but snacks in the BGA. At least what I
found once
/Inge
----- Original Message -----
From: "Grossmann, Guenter" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, October 27, 2010 9:36 AM
Subject: [TN] Cracks in BGA solderjoints
Hi Technetters
I have an effect in BGA solder joints that I have never seen before.
In microsections and in FIB preparations I see cracks between the IMC and a
slightly darker region towards the Ni which I assume to be a P enriched zone
of the Ni. However, the cracks are somewhere in the width of the solder
joint and they are quite short running out to a row of pores that look
somehow like Kirkendall voids.
Is there still a possibility to place one or two pictures? Kim's IPC site
doesn't work.
Best regards
Günter
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