John,
Inge has pretty well covered the specifications end of it.
If I were the party doing the wire bonding, I would certainly also want to
be provide my input with respect to the bonding footprint, be responsible
for defining the plating, and performing the die attach operation - as well
as the wire bonding portion of the operation.
As a microelectronics materials type of person, I get into the specifics of
the polymers used for die attach and encapsulation - hence, what method do
you plan to utilize for device protection after wire bonding? Transfer
molding, dam and fill, other? This all needs to be thought out.
Best wishes
Steve Creswick
http://www.linkedin.com/in/stevencreswick
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Friday, October 22, 2010 1:59 PM
To: [log in to unmask]
Subject: Re: [TN] MCM modules
ASTM F459 Wire bond testing
MILL-STD-883 Method 2023 Non destructive pull test
ASTM F107 wire ball shear
MIL-STD-883 Method 5088 qualification of bonds
IPC-H-855 Hybrid Microcircuit Design Guide
IPC-HM-860 Performance Specification for Hybrid Multilayer ( MCM)
IPC-MC-790 Guidelines for MCM Utilization
The King of Bonding, Steve Cruxwick, will probably add what I did not
remember.
Inge
----- Original Message -----
From: "Inge" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, October 22, 2010 6:46 PM
Subject: Re: [TN] MCM modules
> there are some, but not many. I'll be back later this evening
> /Inge
>
>
> ----- Original Message -----
> From: "John Foster" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Friday, October 22, 2010 5:48 PM
> Subject: [TN] MCM modules
>
>
> This might not be the right place to ask this question.
>
> We are going to be doing our first MCM module on a
>
> Organic substrate. I have already looked at IPC-2225 and
>
> IPC-SM-784 and we are meeting with the company who
>
> Will be doing the bond out. I was just wondering if there
>
> Are any guidelines or other specs out there that might be helpful.
>
>
>
> Thanks
>
>
>
>
> ______________________________________________________________________
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