ASTM F459  Wire bond testing
MILL-STD-883 Method 2023  Non destructive pull test
ASTM F107 wire ball shear
MIL-STD-883 Method 5088 qualification of bonds
IPC-H-855 Hybrid Microcircuit Design Guide
IPC-HM-860 Performance Specification for Hybrid Multilayer ( MCM)
IPC-MC-790  Guidelines for MCM Utilization

The King of Bonding, Steve Cruxwick, will probably add what I did not 
remember.

Inge






----- Original Message ----- 
From: "Inge" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, October 22, 2010 6:46 PM
Subject: Re: [TN] MCM modules


> there are some, but not many. I'll be back later this evening
> /Inge
>
>
> ----- Original Message ----- 
> From: "John Foster" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Friday, October 22, 2010 5:48 PM
> Subject: [TN] MCM modules
>
>
> This might not be the right place to ask this question.
>
> We are going to be doing our first MCM module on a
>
> Organic substrate. I have already looked at IPC-2225 and
>
> IPC-SM-784 and we are meeting with the company who
>
> Will be doing the bond out. I was just wondering if there
>
> Are any guidelines or other specs out there that might be helpful.
>
>
>
> Thanks
>
>
>
>
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