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October 2010

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Subject:
From:
John Foster <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 22 Oct 2010 08:48:54 -0700
Content-Type:
text/plain
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text/plain (34 lines)
This might not be the right place to ask this question.

We are going to be doing our first MCM module on a 

Organic substrate. I have already looked at IPC-2225 and

IPC-SM-784 and we are meeting with the company who

Will be doing the bond out. I was just wondering if there

Are any guidelines or other specs out there that might be helpful.

 

Thanks

 


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