Dear technetters,

Iam referring an observation that we have in our PCB fab line. We observe
some small growth like projections on copper pads / tracks after copper
plating. These boards are plated with lower current density and for a
longer time. The same boards in the same chemical baths were plated with
higher current density for a shorter time wherein we do not observe this
at all. We had filtered the complete bath solution in the plating cell and
also cleaned up the anode bags etc.

We are not able to understand whether there is any difference when we
plate with a higher current density which avoids such growth like
projections.

Anybody can give some inputs in this

Regards

pradeep


______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------