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October 2010

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Werner Engelmaier <[log in to unmask]>
Date:
Thu, 21 Oct 2010 12:42:00 -0400
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 Hi Bev,
You are right, I was thinking PCB only.
That king of quality certainly is possible, but at much lower plating rates.
Werner

 


 

 

-----Original Message-----
From: Bev Christian <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, Oct 21, 2010 12:31 pm
Subject: Re: [TN] Want to buy electrolytic copper foil


Werner,

You are thinking in only the PCB space.  I have in my hot little hands a 

cardboard tube from EM Science that was filled with “Copper ACS Foil, 

Electrolytic”.  And as you probably know ASC standards for the American Chemical 

Society and adding that to the label of your material is pretty serious 

business.  The assay beside the main title portion of the label says Assay Min 

99.9% and then it goes on to list the impurities, all at very low levels. So 

there does indeed appear to exist electrolytic copper in the purity range I 

asked about.

Bev

RIM

From: Werner Engelmaier [mailto:[log in to unmask]]

Sent: Wednesday, October 20, 2010 5:58 PM

To: [log in to unmask]; Bev Christian

Subject: Re: [TN] Want to buy electrolytic copper foil



Hi Bev,

Electrolytic copper foil of at least 99.9% purity is essentially a contradiction 

in terms. Commercial electrolytic Cu foil is plated at very high plating current 

densities—for reasons of economy, of course, which requires quite a witches brew 

of organic and other additives to be able to plate Cu with good physical 

properties and at a high rate. Some of these organics plate out on the grain 

boundaries, and that is the reason why Cu foil is sold by weight [oz/ft2] and 

with approximate thickness—the density is a variable.



Werner

Upcoming workshops:

September 21, European Electronics Assembly Reliability Summit, Tallinn, 

Estonia,

      “Solder Joint Reliability-Part 1: Fundamentals in Solder Joint 

Reliability”

September 21, European Electronics Assembly Reliability Summit, Tallinn, 

Estonia,

      “Solder Joint Reliability-Part 2: Failure Mode and Root Cause Analyses 

(Fatigue, Brittle Fracture, ENIG)”

November 2 & 9, SMTA Webtorial,

     “Fundamentals in Solder Joint Reliability”

December 7 & 14, SMTA Webtorial,

     “Acceleration Models, Accelerated Reliability Tests and Screening 

Procedures”









-----Original Message-----

From: Bev Christian <[log in to unmask]>

To: [log in to unmask]

Sent: Wed, Oct 20, 2010 2:26 pm

Subject: [TN] Want to buy electrolytic copper foil



TechNetters,















Where can I buy a roll of 0.002" thick electrolytic copper foil of at least















99.9% purity?















Bev















RIM





























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