Hi Graham -  your proposed process will work but make sure to be very 
rigid on the process time and temperatures. Most ceramics have 
metallization that is comprised of fired metallic inks and you risk 
completely removing the pads by dissolution (aka leaching) if you don't 
accurately control the process time/temperatures. Good Luck.

Dave Hillman
Rockwell Collins
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Graham Collins <[log in to unmask]> 
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10/19/2010 09:17 AM
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[TN] Soldering a flex to a ceramic wafer






Hello Technet
I've been asked to look at an interesting R&O project.  We have a flex
soldered to SMT pads on a ceramic wafer, we need to replace some wafers.
My first thoughts are to use a hot air tool to reflow the solder and
remove the flex from the old wafer, and then maybe screen some paste on
the new wafer, align the flex and again use the hot air to reflow it.

Any opinions on this, am I out to lunch or on the right track?

Thanks!

Graham Collins 
L-3 Communications ES


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