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October 2010

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Subject:
From:
John Burke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Burke <[log in to unmask]>
Date:
Tue, 19 Oct 2010 07:22:24 -0700
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text/plain
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text/plain (67 lines)
 How many layers on that flex?. Need to be a little careful with that
because of the adhesives on a multi layer are not as robust as a circuit
board assembly.

Also the ceramix will soak heat due to the TTC so suggest pre heating on a
hot plate.

John

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Graham Collins
Sent: Tuesday, October 19, 2010 7:17 AM
To: [log in to unmask]
Subject: [TN] Soldering a flex to a ceramic wafer

Hello Technet
I've been asked to look at an interesting R&O project.  We have a flex
soldered to SMT pads on a ceramic wafer, we need to replace some wafers.
My first thoughts are to use a hot air tool to reflow the solder and remove
the flex from the old wafer, and then maybe screen some paste on the new
wafer, align the flex and again use the hot air to reflow it.

Any opinions on this, am I out to lunch or on the right track?

Thanks!

Graham Collins
L-3 Communications ES


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