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| Date: | Tue, 19 Oct 2010 08:51:58 -0500 |
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SMT components are seldom clamped. Is there a reason you do not underbond or cornerbond these components?
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Noel, William J - GS
Sent: Tuesday, October 19, 2010 8:23 AM
To: [log in to unmask]
Subject: [TN] SMT Devices
IPC-2221 Par 8.1.9 is based around the 5gram/lead through-hole recommendation but I am looking for recommendations for when additional clamping is needed for SMT devices. For instance, we provided a clamping feature for our 208 pin qfp. Our old in-house recommendation was any part over 6 grams (total) required additional hold-down features. (lacing tape, tie-wrap, clamping etc) I cannot find an IPC reference for this. Any help would be appreciated.
Bill Noel
ITT
Geospatial Systems Division
400 Initiative Drive
Rochester, New York 14606-0488
P: (585) 269-5911
F: (585) 672-8042
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