Well, indeed I meant the lower part of the page, last line:
Charlie B: You mentioned that you have an air conditioned environment and a RH 0rf 50, baking the boards is predominately done when the history of the PCB delivery and / or previous storage conditions are un known. When I was with a CM, we did this as a matter of course ( being in NZ, as we don't have the stable contol wrt to Customers boards). Baking is usually done in a temperature changer, with adequate circulation for each PCB and baked at a constant 80 degrees for 12 hours. A similar practise can be performed with micros to avoid "pop-corning) The other thing I was a bit conserned about is you mentionedyour shelf life of PCBs. How long you can store PCBs is dependant on the finish. From what I understand HASL, 1 year, then they need to be re done idealy, gold flash, 6 months, and OSP 3 months. I hope I have helped Marc
----- Original Message -----
From: Paul Edwards
To: Inge ; [log in to unmask]
Sent: Friday, October 15, 2010 11:38 PM
Subject: RE: [TN] Storage of parts, side question
Yes... Bake prior to RoHS assembly... Had 30% of 1 lot and 10% of another lot with internal bubbles (delamination) when reflowed...
Started baking after that...No problems since...
Paul
Paul Edwards
Surface Art Engineering
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Friday, October 15, 2010 2:27 PM
To: [log in to unmask]
Subject: [TN] Storage of parts, side question
We have been discussing storage and humidity impact etc. Year 2000, the
following was announced at SMT:
http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=970&
What is your opinion about those comments? Is that recommended even today?
Need no long exploration, only yes or no.
Inge
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