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October 2010

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Subject:
From:
Paul Edwards <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Paul Edwards <[log in to unmask]>
Date:
Fri, 15 Oct 2010 14:38:14 -0700
Content-Type:
text/plain
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text/plain (70 lines)
Yes... Bake prior to RoHS assembly... Had 30% of 1 lot and 10% of another lot with internal bubbles (delamination) when reflowed...

Started baking after that...No problems since...

Paul

Paul Edwards
Surface Art Engineering


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Friday, October 15, 2010 2:27 PM
To: [log in to unmask]
Subject: [TN] Storage of parts, side question

We have been discussing storage and humidity impact etc.  Year 2000, the 
following was announced at SMT:

http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=970&

What is your opinion about those comments? Is that recommended even today? 
Need no long exploration, only yes or no.

Inge 


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