Mark,
The industry specs are as follows:
IPC/JEDEC J-STD-020, Moisture/Reflow Sensitivity Classification for
Plastic Integrated Circuit (IC) SMDs
IPC/JEDEC J-STD-033, Standard for Handling, Packing, Shipping and Use of
Moisture Reflow Sensitive SMDs
IPC/JEDEC J-STD-035, Acoustic Microscopy for Non-hermetic Encapsulated
Electronic Components
IPC-9501, PWB Assembly Process Simulation for Evaluation of Electronic
Components (Preconditioning IC Components)
IPC-9502, PWB Assembly Soldering Process Guideline for Electronic
Components
IPC-9503, Moisture Sensitivity Classification for Non-IC Components
IPC-9504, Assembly Process Simulation for Evaluation of Non-IC
Components (Preconditioning Non-IC Components).
Also, the newly released IPC-1601, Printed Board Handling and Storage
Guidelines, covers bare boards.
Mike Buetow
Circuits Assembly
w/m 617-327-4702
>>> The CIRCUITS ASSEMBLY Directory of EMS Companies -- 2,000 Listings
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Mark Larson
Sent: Friday, October 15, 2010 10:11 AM
To: [log in to unmask]
Subject: [TN]
Hi All,
I am interested in finding out more info on storage of components before
use, some component makers have info on their site, some do not. Is this
the appropriate area to ask, is there another site that might be better?
How are people handling the issue of sealed packaging and the need to
test? It seems counterproductive to open the package to test, and then
throw it in a warehouse where it may sit for gawd only knows how long
before use.
ML CID+
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