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| Date: | Mon, 11 Oct 2010 14:51:51 -0400 |
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What's going on with the picture of the cross section? The ball isn't wetting down the side of the plated pad.
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From: TechNet [mailto:[log in to unmask]] On Behalf Of Chris Mahanna
Sent: Monday, October 11, 2010 2:41 PM
To: [log in to unmask]
Subject: Re: [TN] Mech. damage or poor wetting?
Here are a few pictures
http://ipc-technet.groupsite.com/gallery/16011
this job is a mixed bag. Currently we suspect soldering, cratering, ICT and t-cycling damage
Chris
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Monday, October 11, 2010 2:22 PM
To: TechNet E-Mail Forum; Chris Mahanna
Cc: [log in to unmask]
Subject: Re: [TN] Mech. damage or poor wetting?
Hi Chris - do you have any pictures you can share?
Dave Hillman
Rockwell Collins
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Chris Mahanna <[log in to unmask]>
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[TN] Mech. damage or poor wetting?
We have a BGA dye-n-pry job that shows board side sj damage with a strong correlation to fan-out clocking.
We also have some microsection evidence of poor wetting.
All damage/dye is on perimeters.
Is this an indication of heat sinking and subpar wetting, or can it be completely mechanical? Both?
Thanks
Chris
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