Subject: | |
From: | |
Reply To: | |
Date: | Mon, 11 Oct 2010 13:59:25 -0400 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Paul, yes.
Joyce, your explanation makes sense...is it common knowledge? Published?
Chris
From: Paul Edwards [mailto:[log in to unmask]]
Sent: Monday, October 11, 2010 1:43 PM
To: TechNet E-Mail Forum; Chris Mahanna
Subject: RE: Mech. damage or poor wetting?
ENIG surface finish on PCB?
Paul
Paul Edwards
Surface Art Engineering
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Chris Mahanna
Sent: Monday, October 11, 2010 9:29 AM
To: [log in to unmask]
Subject: [TN] Mech. damage or poor wetting?
We have a BGA dye-n-pry job that shows board side sj damage with a strong correlation to fan-out clocking.
We also have some microsection evidence of poor wetting.
All damage/dye is on perimeters.
Is this an indication of heat sinking and subpar wetting, or can it be completely mechanical? Both?
Thanks
Chris
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
________________________________
This email and any attachments thereto may contain private, confidential, and privileged material for the sole use of the intended recipient. Any review, copying, or distribution of this email (or any attachments thereto) by others is strictly prohibited. If you are not the intended recipient, please contact [log in to unmask]<mailto:[log in to unmask]> immediately and permanently delete the original and any copies of this email and any attachments thereto.
________________________________
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|