Hi Wee,
Microsections (XS) do take awhile to learn how to read and Ian is very
accomplished at XS interpretation.
From a quality point of view you can review copper thicknesses, line
width, hole roughness, drill smear, nail heading, etch back and the list
goes on, and on. You get a good insight on many process steps used to
fabricate PWBs, but that comes with experience.
The industry processes microsections on any number of planes, through
any number of structures, to find out different things about the board.
A vertical section through the via is most common. Horizontal sections
help understand registrations and on occasion find CAF (Ian did once).
My area of expertise is in understanding the reliability implications of
failed vias. You may find my column Reid on Reliability in iconnect007
useful. Here is a link to a column on PTH wear out.
http://www.pcb007.com/pages/zone.cgi?a=58530&artpg=1&topic=0
The column will link to other columns that address interpretation of
failed coupons by means of microsections.
Sincerely,
Paul Reid
Program Coordinator
PWB Interconnect Solutions Inc.
235 Stafford Rd., West, Unit 103
Nepean, Ontario
Canada, K2H 9C1
613 596 4244 ext. 229
Skype paul_reid_pwb
[log in to unmask] <mailto:[log in to unmask]>
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ian Hanna
Sent: October 1, 2010 10:41 AM
To: [log in to unmask]
Subject: Re: [TN] Microsection
Wee Mei -- Vias typically represent worst-case drilling and plating and
are a good indication of the overall board build quality...I would think
they were doing you a favour. In my former life as quality in a fab
house
I would examine vias for my internal purposes, but forward the larger
PTH
as part of the microsection puck unless otherwise specified by my
customers -- Cheers -- Ian
Lum Wee Mei <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
10/01/2010 10:35 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Lum Wee Mei <[log in to unmask]>
To
[log in to unmask]
cc
Subject
[TN] Microsection
With regard to PCB microsection, is it a must that microsection has to
be
done on plated through holes. I received a pre- and post microsection
samples from my vendor and noticed that they are done across the plated
through via. Of course, the solder cannot flow through the walls of the
vias on the post solder sample. Can I accept this post solder sample and
use it to verify the fabrication process? If yes, what are the reasons.
I am learning the trade by myself and would appreciate I can learn from
the experts in the field. If there is any articles on how to interpret
the
microsection sample for PCB such how to differentiate electroless copper
from copper plating and then the tin-lead plating in the wall or pad
surface, etc would also be most appreciated.
Thanks and Regards,
~ Wee Mei ~
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or
[log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask]
or
847-615-7100 ext.2815
-----------------------------------------------------
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or
[log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|