I don't think I've seen this covered before.  On a number of layouts that I've done, I've added some top or bottom layer metal round components that might dissapate some heat.  However, I've always left the soldermask over these areas, since it's not a pad to solder to--it's just an attempt to spread some heat, just in case.  [I generally use a "real" heatsink if I know it will make heat.]

However, it seems that a good chunk of the time I get asked by board houses if this is a pad to solder to, and if I made a mistake.  No biggie to correct this (they find plenty of real issues), but I'm wondering if this is somehow in violation of good design practice.

Thanks.

Shawn Upton

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