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September 2010

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Subject:
Re: Stencil thickness v solder paste height
From:
Robert Kondner <[log in to unmask]>
Reply To:
[log in to unmask]
Date:
Mon, 6 Sep 2010 14:20:41 -0400
Content-Type:
text/plain
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text/plain (79 lines) 
Eric,

 Good question, if you look at the web sites for folks that vend 3D paste
inspection system I bet you can find some good data.

 What I have seen is the surface of the PCB is not flat, solder mask and
silk screen ink act like hold offs at time. Tented vias for big high blobs. 

 And, of course, there is scoping of paste from plastic squeegees. 

Bob Kondner

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Eric Christison
Sent: Monday, September 06, 2010 11:02 AM
To: [log in to unmask]
Subject: [TN] Stencil thickness v solder paste height

I guess this is an easy one for most you...

If solder paste is applied to a PWB with a 0.10+/-0.01mm thick stencil 
what is the minimum height of paste I can expect to get on the PWB?

Sn95.5Ag3.8Cu0.7 paste , DAP (20 - 38 ìm) or Sn95.5Ag4.0Cu0.5, IPC type 
3 (25-45 ìm) if composition makes much difference.

Thanks,

-- 
Eric Christison
Consumer&  Micro group
Imaging Division

STMicroelectronics (R&D) Ltd
33 Pinkhill
Edinburgh EH12 7BF
United Kingdom

Tel:	+44 (0)131 336 6165
Fax:	+ 44 (0)131 336 6001




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