I guess this is an easy one for most you...

If solder paste is applied to a PWB with a 0.10+/-0.01mm thick stencil 
what is the minimum height of paste I can expect to get on the PWB?

Sn95.5Ag3.8Cu0.7 paste , DAP (20 - 38 μm) or Sn95.5Ag4.0Cu0.5, IPC type 
3 (25-45 μm) if composition makes much difference.

Thanks,

-- 
Eric Christison
Consumer&  Micro group
Imaging Division

STMicroelectronics (R&D) Ltd
33 Pinkhill
Edinburgh EH12 7BF
United Kingdom

Tel:	+44 (0)131 336 6165
Fax:	+ 44 (0)131 336 6001




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