Dave,
Does that line ever work? Is this to include PTHs that have components
and were soldered by you or Doug?
Do you want Lead-free or eutectic as the final finish and reflowed in a
eutectic, mixed metallurgy or Lead-free processing medium?
IPC EXPO 2006 this was presented "Reliability of Partially Filled SAC305
Through-Hole Joints".
I am slowly putting a white paper together for an IPC Handbook for
Lead-free Assembly. Many papers so far but no organization or search
capability yet.
If you could be more specific I may have a few more right now.
Dewey


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Thursday, September 23, 2010 9:31 AM
To: [log in to unmask]
Subject: [TN] Leadfree Plated Thru Hole Thermal Cycle Reliability Paper
Hunt

Hi folks! I am on a fishing exposition: I am looking for plated thru
hole 
thermal cycle reliability reports/papers. I have a ton (literally) of 
surface mount technology investigations but we have just finished up a 
leadfree wave solder alloy thermal cycle solder joint integrity 
investigation and I am in search of published data sets so I can do a 
results comparison.  I do have the papers by C. Hamilton/Celestica which

are very good but I am in quest of additional report data sets. If you 
know of any published reports, please drop me an email. 

Thanks in advance. 

Dave Hillman
Rockwell Collins
[log in to unmask]

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