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September 2010

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From:
"Thayer, Wayne - IIW" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Thayer, Wayne - IIW
Date:
Tue, 21 Sep 2010 11:37:07 -0400
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De-zincification is a problem only if subjected to a corrosive environment or submerged in an electrolyte with other metals.  I doubt ImAg would be sufficient to slow this process down.  I might want electroplated nickel or tin for that.

I've seen other posts on TechNet which panic over exposed brass, so I did some long term tests with relatively high current densities and Pb based solder--absolutely no issues.  And the dissolution rate of brass into molten solder appears to be at least as low as copper.

If it's an outdoor location subjected to salt spray, I'd certainly want it coated, but I see no reason why it should be looked at as more susceptible to failure than standard leaded components (which will always be conformal coated for harsh environments).

Wayne

-----Original Message-----
From: Rex Waygood [mailto:[log in to unmask]] 
Sent: Tuesday, September 21, 2010 11:30 AM
To: TechNet E-Mail Forum; Thayer, Wayne - IIW
Subject: RE: [TN] Solderability of nickel plating

Does the ImAg stop de-zincification?
Rex 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Thayer, Wayne - IIW
Sent: 21 September 2010 16:22
To: [log in to unmask]
Subject: Re: [TN] Solderability of nickel plating

Why nickel? I use ImAg over brass for lots of stuff around here.  Works
great, but will tarnish over time.

Wayne

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Glidden, Kevin
Sent: Tuesday, September 21, 2010 9:38 AM
To: [log in to unmask]
Subject: Re: [TN] Solderability of nickel plating

OK, pardon the lack of knowledge, but why is that?  I also see reference
to nickel-boron platings, which supposedly improve both conductivity and
solderability for electronics applications.

Is it recommended then that I need to apply gold over the EN on this
electrical tab?  A portion of it is soldered (internally) and a portion
of it remains exposed for connection (think 120V plug tabs).  The base
material is brass.

Kevin Glidden
Manufacturing Engineer
Astronics Luminescent Systems Inc.

-----Original Message-----
From: vladimir Igoshev [mailto:[log in to unmask]]
Sent: Tuesday, September 21, 2010 9:24 AM
To: TechNet E-Mail Forum; Glidden, Kevin
Subject: Re: [TN] Solderability of nickel plating

Kevin,

You wouldn't want to solder directly to unprotected  E-Ni.
Vladimir

SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca

-----Original Message-----
From: "Glidden, Kevin" <[log in to unmask]>
Sender: TechNet <[log in to unmask]>
Date:         Tue, 21 Sep 2010 08:52:39
To: <[log in to unmask]>
Reply-To: TechNet E-Mail Forum <[log in to unmask]>,
        "Glidden, Kevin" <[log in to unmask]>
Subject: [TN] Solderability of nickel plating

All,

Can anyone comment on the solderability of the nickel plate,
particularly with regard to type of plating: high phosphor / low
phosphor, and also storage conditions:

I've been gathering info, and seen conflicting information.

From one article:
http://corrosion-doctors.org/MetalCoatings/Electroless.htm

A paper submitted at the Electroless Nickel conference of 1989 held in
Cincinnati Ohio, Titled "Solderability Parameters of Elecroless Nickel
Bearing Electronic Finishes" By Louis Kosarek of STB Systems, Inc.
report that "An electroless nickel deposit which contains a
concentration of phosphorus ranging from 0.1% to 3.0% is readily
solderable on an "As-plated Basis" per Mil-Std 883c method 2003. The
frequency of solderability tests which fail per Mil-Std 883c will
increase as the phosphorus content of electroless nickel alloy increases
from 3.0 to 7.0% phosphorus. A solderability test conducted per Mil-Std
883c method 2003 incorporating an as-plated surface finish containing
phosphorus in excess of 7%, the components will consistently fail. The
mode of failure is non-wetting of the surface."
This indicates low phosphorous plating is best for solderability.  Many
other papers seem to agree with this.

------------------------------------------------------------------------
---------------------------------------------

From another article: http://www.pfonline.com/articles/pfd0024.html

Solderability/Weldability.  An important aspect of electroless nickel to
the electronics industry is its solderability. All electroless nickel
deposits are solderable provided the soldering conditions are matched to
the condition of the particular electroless nickel deposit.
Lower-phosphorus electroless nickel is more easily solderable
immediately after plating than higher-phosphorus electroless nickel.
However, this advantage disappears after 12 - 24 hrs. At this point, the
ease of solderability depends upon the characteristics of the passive
layer that forms on the surface of the electroless nickel deposit. Those
deposits plated from baths containing heavy metal and sulfur-bearing
brighteners and stabilizers, such as most commercial low- and
mid-phosphorus electroless nickel systems, form a thicker tenacious
passive layer than those that do not, such as most high-phosphorus
electroless nickel systems. High-phosphorus electroless nickel systems
tend to be more solderable in aged deposits.

Other important factors influencing the solderability of electroless
nickel deposits include residual contamination left on the surface after
plating and storage conditions after drying. Surface contamination and
exposure to environments containing sulfur dioxide, chlorine, high
humidity and high ambient temperatures will detrimentally affect
solderability. Therefore, it is imperative that parts be thoroughly
rinsed in clean DI water, dried and stored in a cool, dry atmosphere,
preferably nitrogen.
This article indicates high phosphorous plating is best for long term
solderability, and also that parts must be stored carefully (cool, dry,
sealed, nitrogen).  Other articles seem to state this is a highly stable
finish and is even used as a corrosion inhibitor.

Thanks,


Kevin Glidden
Manufacturing Engineer
Astronics Luminescent Systems Inc.<http://www.astronics.com>
4 Lucent Drive
Lebanon, NH 03766
(603) 643-7766 x3152

Please note, LSI operates on a 9/80 work schedule, and is closed on
alternating Fridays.  Please click the link provided to view the days
LSI will be closed.
http://www.astronics.com/LSI/documents/2010calendar-NH.pdf

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