Here is the referenced text from J-STD-001E. I'm not sure why it was converted to an image.
4.18.2 Solder Connection Defects The following solder connection conditions shall [D1D2D3] be considered defects:
a. Fractured solder connections.
b. Disturbed solder connections.
c. Cold or rosin solder connections.
d. Solder that violates minimum electrical clearance (e.g., bridges), or contacts the component body (except as noted in 7.5.7
and 7.5.8).
e. Fails to comply with wetting criteria of 4.18.
f. Solder bridging between connections except when path is present by design.
Thanks,
Wayne
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Monday, September 20, 2010 12:40 PM
To: [log in to unmask]; Knapp, Wayne B
Cc: [log in to unmask]
Subject: RE: Questions related to J-STD-001E
No image available!!!!
"X"
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Knapp, Wayne B
Sent: Monday, September 20, 2010 12:02 PM
To: [log in to unmask]
Subject: [TN] Questions related to J-STD-001E
I'm a new member and hope that this is the correct forum for questions. My question is related to IPC J-STD-001E, Section 4.18.2, Solder Connection Defects. In particular, I would like to know how Item "f." is to be interpreted (See reference below). Is the intent of item "f." to,
1) allow a solder connection within the confines of the solder pads and connecting solder path as the design allows,
or
2) does it allow solder "bridging" outside the solder boundaries (solder pads and connecting solder path) and solder is allowed to come in contact with the circuit board.
[cid:[log in to unmask]]
It appears that item "f." was not part of the standard in Revision B, but was added to the standard in Revision C. With that said, I'm hopeful that someone in this forum can shed some light on the original intent of Item "f."
Thanks,
Wayne
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