I'm guessing this may have been meant to cover situations where you bridge between two very closely placed pads with a dollop of solder to "program" a board for certain options.  I've seen triangular pads, placed base to base, used in this manner.

Gregg

-----Original Message-----
From: Knapp, Wayne B [mailto:[log in to unmask]] 
Sent: Monday, September 20, 2010 10:02 AM
To: [log in to unmask]
Subject: [TN] Questions related to J-STD-001E

I'm a new member and hope that this is the correct forum for questions.  My question is related to IPC J-STD-001E, Section 4.18.2, Solder Connection Defects.  In particular, I would like to know how Item "f." is to be interpreted (See reference below).  Is the intent of item "f."  to,


1)      allow a solder connection within the confines of the solder pads and connecting solder path as the design allows,
or

2)      does it allow solder "bridging" outside the solder boundaries (solder pads and connecting solder path) and solder is allowed to come in contact with the circuit board.

[cid:[log in to unmask]]

It appears that item "f." was not part of the standard in Revision B, but was added to the standard in Revision C.  With that said, I'm hopeful that someone in this forum can shed some light on the original intent of Item "f."

Thanks,
Wayne


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