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September 2010

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Fri, 17 Sep 2010 14:18:55 -0400
Content-Type:
text/plain
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text/plain (165 lines)
Wow, your subcon is very scary!  Are they legally binding for all the potential fall out?  Check their legal fee or insurance, may be they are the one willing to fight in the court or got fat wallet ready to pay all the warrantees and damages.  You got stuck this time, may be next time choose subcon wisely?  (don't tell me your contract dept went to the cheap bid). 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lum Wee Mei
Sent: Friday, September 17, 2010 1:46 PM
To: [log in to unmask]
Subject: Re: [TN] Crack and oxidisation on IC leads

The subcon will not remove the IC for a cross-section as they do not think the IC will have any reliability or functionality issue. They want me to waive off my observation so that the IC can stay on the board and to be used.

I have no reliability background but what I observed do disturb me. It has the potential to cause this PCBA to fail during its field operation. This is the rationale I reject this component. Unfortunately, the subcontractor is hard to convince.

Thanks and Regards,
~ Wee Mei ~

  _____

From: TechNet on behalf of Werner Engelmaier
Sent: Sat 9/18/2010 1:28 AM
To: [log in to unmask]
Subject: Re: [TN] Crack and oxidisation on IC leads




 Nee hao Wee Mei,
When beding leads over a small radius, surface cracks can occur if the lead material is not  at least quarter-hard annealed or softer-these cracks typically do not cause any problems. HOWEVER, the photos you sent Steve show cracks substantially more severe-I concur with Vladimir that cross-sections are definitely called for  to make a more accurate assessment.
Werner








-----Original Message-----
From: Lum Wee Mei <[log in to unmask]>
To: [log in to unmask]
Sent: Fri, Sep 17, 2010 8:07 am
Subject: [TN] Crack and oxidisation on IC leads


Dear All,



During PCBA inspection, we noticed cracked line across the entire IC lead width

at the knee location. It happen to the whole row on one side of the IC and we

consider it a reject. However, our production subcontractor do not concur the

component as reject. They said that the crack is only fine line and is unlikely

to cause any major physical issue to the leads itself.



In another IC, we noticed a small area of oxidation on one of the lead of about

1 - 1.5mm in size. Again the subcontractor do not accept our decision that it is

a reject. The reason given by them is that although the corrosion exposed the

base metal it is acceptable because the exposed surface is not part of the

required solder fillet.



I have tried to upload the photo on IPC Technet but not successfully. Hope from

your experience, you can provide some opinions.



Thanks and Regards,

~ Wee Mei ~



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