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September 2010

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Subject:
From:
vladimir Igoshev <[log in to unmask]>
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Date:
Fri, 17 Sep 2010 11:44:06 +0000
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Section will do it. Keep in mind though, that the board would have to be overplated with another layer of E-Ni to prevent Au smearing during polishing.
Vladimir

SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca

-----Original Message-----
From: Fabien Guizelin <[log in to unmask]>
Sender: TechNet <[log in to unmask]>
Date:         Fri, 17 Sep 2010 07:14:09 
To: <[log in to unmask]>
Reply-To: TechNet E-Mail Forum <[log in to unmask]>,
        Fabien Guizelin <[log in to unmask]>
Subject: [TN] How to measure thickness of ENIG plating inside the via barrel

Hi 

IPC-4552 calls for XRF to measure ENIG plating thickness. But, this method can only be applied to surface pads.  How can we assess the quality of the plating in via barrel ?    (poor plating would compromise mechanical strength and resistance to corrosion)

Thanks for your insight

Fabien


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