TECHNET Archives

September 2010

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Werner Engelmaier <[log in to unmask]>
Date:
Tue, 14 Sep 2010 09:31:36 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (803 lines)
 Hi Victor,
Dewey pointed you in the right direction—use IPC-TM-650, Method 2.6.27 for your test.


 
IPC-TM-650, 2.6.8 was never intended for thicker PWBs, even though they need a test like this even more, that was the reason for 2.6.27.
If you do not get the holes to fill, that means that the PWB never reached uniform temperature, thus the test is invalid for its purpose—it needs a longer time floating.
Werner


 

-----Original Message-----
From: Victor Hernandez <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, Sep 14, 2010 8:07 am
Subject: Re: [TN] FW: IPC-TM-650,  2.6.8


Folks,

  What is the industry doing with Thermal Stress testing for boards thicker than 

the traditionally 62 thousand.   To me this is like LF, it was introduce, so 

find solution to overcome unforeseeable issues.   The larger/thicker board are 

here so what is the acceptable method of testing under TM-650.



"X"



From: Whittaker, Dewey (EHCOE) [mailto:[log in to unmask]]

Sent: Monday, September 13, 2010 12:55 PM

To: Hernandez, Victor G

Subject: RE: [TN] FW: IPC-TM-650, 2.6.8, BAKING OF PWB QUESTION,





Re-read my first sentence. There are too many variables. All the initial 

requirements for hole fill were based on 0.063 thick printed boards.



Dewey







-----Original Message-----

From: [log in to unmask] [mailto:[log in to unmask]]

Sent: Monday, September 13, 2010 10:44 AM

To: Whittaker, Dewey (EHCOE)

Cc: [log in to unmask]

Subject: RE: [TN] FW: IPC-TM-650, 2.6.8, BAKING OF PWB QUESTION,







On thicker boards, is it expected to fill the PTH with solder during a Thermal 

Stress/Float Test?   Aspect ratio plays a part.   What is expected.







"X"







-----Original Message-----



From: Whittaker, Dewey (EHCOE) [mailto:[log in to unmask]]



Sent: Monday, September 13, 2010 12:38 PM



To: Hernandez, Victor G



Subject: RE: [TN] FW: IPC-TM-650, 2.6.8, BAKING OF PWB QUESTION,







This is a design/processing issue. I thought you wanted to know which one was an 

acceptable test for use in LF applications.



Dewey







-----Original Message-----



From: [log in to unmask] [mailto:[log in to unmask]]



Sent: Monday, September 13, 2010 10:32 AM



To: Whittaker, Dewey (EHCOE)



Cc: [log in to unmask]



Subject: RE: [TN] FW: IPC-TM-650, 2.6.8, BAKING OF PWB QUESTION,







I want to known in either case but need to understand why things happened.   In 

62 thousands boards one can see that the PTH filled with solder, therefore heat 

was disperse through the layer thickness and IPs.   On thicker boards, 220  

mils, the PTH holes did not fill with solder.   Thus the question, did the heat 

from the molten solder travel the length of the barrel and IPs.







"X"







-----Original Message-----



From: Whittaker, Dewey (EHCOE) [mailto:[log in to unmask]]



Sent: Monday, September 13, 2010 12:21 PM



To: TechNet E-Mail Forum; Hernandez, Victor G



Subject: RE: [TN] FW: IPC-TM-650, 2.6.8, BAKING OF PWB QUESTION,







Which is worse: knowing; or not knowing?



IPC-TM-650, Method 2.6.8 - not knowing



IPC-TM-650, Method 2.6.27 - knowing



Dewey











-----Original Message-----



From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez



Sent: Monday, September 13, 2010 10:02 AM



To: [log in to unmask]



Subject: [TN] FW: IPC-TM-650, 2.6.8, BAKING OF PWB QUESTION,







Fellow TechNetters:







   Which is worse:   The initial shock of the molten solder or the Constance 

thermal cycling?   On thicker boards, 220 mils, when the solder did not wick the 

entire barrel.  Is this a valid thermal shock?







"X"







-----Original Message-----



From: Hernandez, Victor G



Sent: Wednesday, August 18, 2010 9:22 AM



To: TechNet E-Mail Forum



Cc: Hernandez, Victor G



Subject: IPC-TM-650, 2.6.8, BAKING OF PWB QUESTION,







Fellow TechNetters:







   IPC-TM-650   2.6.8







Can this test method be used for LF application:



Sample is 24 layers mid plane, FR4, back/front side drilling,



0.019 & 0.020 finish hole size,







Any comments will greatly be appreciated.







Victor ( "X" )











-----Original Message-----



From: TechNet [mailto:[log in to unmask]] On Behalf Of Paul Reid



Sent: Tuesday, July 13, 2010 3:55 PM



To: [log in to unmask]



Subject: Re: [TN] BAKING OF PWB QUESTION







My rule of thumb has been 105°C for 4 hours max.







Consider



- Time and temperature degrades the dielectric.



- Time and temperature degrades the surface finish.



- Lead/free applications have a greater need for baking as compared to tin/lead 

applications.











Paul Reid







Program Coordinator



PWB Interconnect Solutions Inc.



235 Stafford Rd., West, Unit 103



Nepean, Ontario



Canada, K2H 9C1



613 596 4244 ext. 229



Skype paul_reid_pwb



[log in to unmask] <mailto:[log in to unmask]>











-----Original Message-----



From: TechNet [mailto:[log in to unmask]] On Behalf Of Roberts, Jon (SA-1)



Sent: July 13, 2010 11:35 AM



To: [log in to unmask]



Subject: [TN] BAKING OF PWB QUESTION







Is there a rule of thumb or any best manufacturing practices of how long



after baking does the PWB have to be processed?   Jon











This communication is intended only for use by the addressee(s) named herein and 

may contain business confidential and/or legally privileged information. If you 

are not the intended recipient of this e-mail, you are hereby notified that any 

dissemination, distribution, disclosure or copying of this e-mail and its 

contents is strictly prohibited. If you have received this e-mail in error, 

kindly notify the sender by replying to this message. In addition, please 

permanently delete the message and any attachments without copying or disclosing 

the contents. Thank you for your cooperation.



THIS DOCUMENT AND/OR SHIPMENT MAY CONTAIN COMMODITY ITEMS, SOFTWARE OR TECHNICAL 

DATA THAT IS CONTROLLED BY U.S. EXPORT LAW, AND MAY NOT BE EXPORTED OUTSIDE THE 

UNITED STATES OR TO NON U.S. PERSONS WITHOUT THE APPROPRIATE EXPORT LICENSE FROM 

EITHER THE U.S. DEPARTMENT OF STATE OR DEPARTMENT OF COMMERCE.











______________________________________________________________________



This email has been scanned by the MessageLabs Email Security System.



For more information please contact helpdesk at x2960 or [log in to unmask]



______________________________________________________________________







---------------------------------------------------



Technet Mail List provided as a service by IPC using LISTSERV 15.0



To unsubscribe, send a message to [log in to unmask] with following text in



the BODY (NOT the subject field): SIGNOFF Technet



To temporarily halt or (re-start) delivery of Technet send e-mail to 

[log in to unmask]: SET Technet NOMAIL or (MAIL)



To receive ONE mailing per day of all the posts: send e-mail to 

[log in to unmask]: SET Technet Digest



Search the archives of previous posts at: http://listserv.ipc.org/archives



Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for 

additional information, or contact Keach Sasamori at [log in to unmask] or 

847-615-7100 ext.2815



-----------------------------------------------------







______________________________________________________________________



This email has been scanned by the MessageLabs Email Security System.



For more information please contact helpdesk at x2960 or [log in to unmask]



______________________________________________________________________







---------------------------------------------------



Technet Mail List provided as a service by IPC using LISTSERV 15.0



To unsubscribe, send a message to [log in to unmask] with following text in



the BODY (NOT the subject field): SIGNOFF Technet



To temporarily halt or (re-start) delivery of Technet send e-mail to 

[log in to unmask]: SET Technet NOMAIL or (MAIL)



To receive ONE mailing per day of all the posts: send e-mail to 

[log in to unmask]: SET Technet Digest



Search the archives of previous posts at: http://listserv.ipc.org/archives



Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for 

additional information, or contact Keach Sasamori at [log in to unmask] or 

847-615-7100 ext.2815



-----------------------------------------------------







______________________________________________________________________



This email has been scanned by the MessageLabs Email Security System.



For more information please contact helpdesk at x2960 or [log in to unmask]



______________________________________________________________________







---------------------------------------------------



Technet Mail List provided as a service by IPC using LISTSERV 15.0



To unsubscribe, send a message to [log in to unmask] with following text in



the BODY (NOT the subject field): SIGNOFF Technet



To temporarily halt or (re-start) delivery of Technet send e-mail to 

[log in to unmask]: SET Technet NOMAIL or (MAIL)



To receive ONE mailing per day of all the posts: send e-mail to 

[log in to unmask]: SET Technet Digest



Search the archives of previous posts at: http://listserv.ipc.org/archives



Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for 

additional information, or contact Keach Sasamori at [log in to unmask] or 

847-615-7100 ext.2815



-----------------------------------------------------



______________________________________________________________________

This email has been scanned by the MessageLabs Email Security System.

For more information please contact helpdesk at x2960 or [log in to unmask] 

______________________________________________________________________



---------------------------------------------------

Technet Mail List provided as a service by IPC using LISTSERV 15.0

To unsubscribe, send a message to [log in to unmask] with following text in

the BODY (NOT the subject field): SIGNOFF Technet

To temporarily halt or (re-start) delivery of Technet send e-mail to 

[log in to unmask]: SET Technet NOMAIL or (MAIL)

To receive ONE mailing per day of all the posts: send e-mail to 

[log in to unmask]: SET Technet Digest

Search the archives of previous posts at: http://listserv.ipc.org/archives

Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for 

additional information, or contact Keach Sasamori at [log in to unmask] or 

847-615-7100 ext.2815

-----------------------------------------------------


 

______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2