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September 2010

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Werner Engelmaier <[log in to unmask]>
Date:
Tue, 14 Sep 2010 09:17:17 -0400
Content-Type:
text/plain
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text/plain (104 lines)
 Hi Chris,
These clips would put the SJs into compression—that means that even when fatigued to fracture, you will not see a functional failure.
Werner

 


 

 

-----Original Message-----
From: Chris Mahanna <[log in to unmask]>
To: [log in to unmask]
Sent: Mon, Sep 13, 2010 10:25 pm
Subject: [TN] Bergquist Gap Pad


We are working on a memory module FA.  Sandwich looks like this:

top of clip

Ni plated Cu heat spreader (goes across all 8 BGAs)

Gap Pad

8 BGAs in a single row

board

Gap Pad

bottom of clip



Has anyone seen more than [expected] damage after natural field cycling (maybe) 

caused by the gap pad?  The material appears to be patented for low-modulus, 

high W/mk  but...



Chris





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