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September 2010

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Subject:
From:
Chris Mahanna <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Chris Mahanna <[log in to unmask]>
Date:
Mon, 13 Sep 2010 22:25:36 -0400
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We are working on a memory module FA.  Sandwich looks like this:
top of clip
Ni plated Cu heat spreader (goes across all 8 BGAs)
Gap Pad
8 BGAs in a single row
board
Gap Pad
bottom of clip

Has anyone seen more than [expected] damage after natural field cycling (maybe) caused by the gap pad?  The material appears to be patented for low-modulus, high W/mk  but...

Chris


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