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September 2010

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TechNet E-Mail Forum <[log in to unmask]>, jan <[log in to unmask]>
Date:
Mon, 13 Sep 2010 16:31:15 +0800
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See  IPC-6012C£¨L£İlast rev , you can find answer from 3.6.2.11.2 copper cap
plating of filled via

Jan Chen

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Fabien Guizelin
Sent: Monday, September 13, 2010 2:55 PM
To: [log in to unmask]
Subject: [TN] Via fill quality

Hi,

Are there any IPC requirements governing the quality of IPC-4761 Type-5b and
Type-6b via filling?
Specifically,  are there any acceptance criteria related to
presence/location of bubbles in the fill material?  Surface dimple depth?
If no IPC requirement exists, what do you consider adequate quality
requirement to specify for these?

Appreciate your inputs.
Thanks

Fabien


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