Folks,
What is the industry doing with Thermal Stress testing for boards thicker than the traditionally 62 thousand. To me this is like LF, it was introduce, so find solution to overcome unforeseeable issues. The larger/thicker board are here so what is the acceptable method of testing under TM-650.
"X"
From: Whittaker, Dewey (EHCOE) [mailto:[log in to unmask]]
Sent: Monday, September 13, 2010 12:55 PM
To: Hernandez, Victor G
Subject: RE: [TN] FW: IPC-TM-650, 2.6.8, BAKING OF PWB QUESTION,
Re-read my first sentence. There are too many variables. All the initial requirements for hole fill were based on 0.063 thick printed boards.
Dewey
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Monday, September 13, 2010 10:44 AM
To: Whittaker, Dewey (EHCOE)
Cc: [log in to unmask]
Subject: RE: [TN] FW: IPC-TM-650, 2.6.8, BAKING OF PWB QUESTION,
On thicker boards, is it expected to fill the PTH with solder during a Thermal Stress/Float Test? Aspect ratio plays a part. What is expected.
"X"
-----Original Message-----
From: Whittaker, Dewey (EHCOE) [mailto:[log in to unmask]]
Sent: Monday, September 13, 2010 12:38 PM
To: Hernandez, Victor G
Subject: RE: [TN] FW: IPC-TM-650, 2.6.8, BAKING OF PWB QUESTION,
This is a design/processing issue. I thought you wanted to know which one was an acceptable test for use in LF applications.
Dewey
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Monday, September 13, 2010 10:32 AM
To: Whittaker, Dewey (EHCOE)
Cc: [log in to unmask]
Subject: RE: [TN] FW: IPC-TM-650, 2.6.8, BAKING OF PWB QUESTION,
I want to known in either case but need to understand why things happened. In 62 thousands boards one can see that the PTH filled with solder, therefore heat was disperse through the layer thickness and IPs. On thicker boards, 220 mils, the PTH holes did not fill with solder. Thus the question, did the heat from the molten solder travel the length of the barrel and IPs.
"X"
-----Original Message-----
From: Whittaker, Dewey (EHCOE) [mailto:[log in to unmask]]
Sent: Monday, September 13, 2010 12:21 PM
To: TechNet E-Mail Forum; Hernandez, Victor G
Subject: RE: [TN] FW: IPC-TM-650, 2.6.8, BAKING OF PWB QUESTION,
Which is worse: knowing; or not knowing?
IPC-TM-650, Method 2.6.8 - not knowing
IPC-TM-650, Method 2.6.27 - knowing
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Monday, September 13, 2010 10:02 AM
To: [log in to unmask]
Subject: [TN] FW: IPC-TM-650, 2.6.8, BAKING OF PWB QUESTION,
Fellow TechNetters:
Which is worse: The initial shock of the molten solder or the Constance thermal cycling? On thicker boards, 220 mils, when the solder did not wick the entire barrel. Is this a valid thermal shock?
"X"
-----Original Message-----
From: Hernandez, Victor G
Sent: Wednesday, August 18, 2010 9:22 AM
To: TechNet E-Mail Forum
Cc: Hernandez, Victor G
Subject: IPC-TM-650, 2.6.8, BAKING OF PWB QUESTION,
Fellow TechNetters:
IPC-TM-650 2.6.8
Can this test method be used for LF application:
Sample is 24 layers mid plane, FR4, back/front side drilling,
0.019 & 0.020 finish hole size,
Any comments will greatly be appreciated.
Victor ( "X" )
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Paul Reid
Sent: Tuesday, July 13, 2010 3:55 PM
To: [log in to unmask]
Subject: Re: [TN] BAKING OF PWB QUESTION
My rule of thumb has been 105°C for 4 hours max.
Consider
- Time and temperature degrades the dielectric.
- Time and temperature degrades the surface finish.
- Lead/free applications have a greater need for baking as compared to tin/lead applications.
Paul Reid
Program Coordinator
PWB Interconnect Solutions Inc.
235 Stafford Rd., West, Unit 103
Nepean, Ontario
Canada, K2H 9C1
613 596 4244 ext. 229
Skype paul_reid_pwb
[log in to unmask] <mailto:[log in to unmask]>
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Roberts, Jon (SA-1)
Sent: July 13, 2010 11:35 AM
To: [log in to unmask]
Subject: [TN] BAKING OF PWB QUESTION
Is there a rule of thumb or any best manufacturing practices of how long
after baking does the PWB have to be processed? Jon
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