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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Keith Calhoun
Sent: Tuesday, September 21, 2010 12:43 PM
To: [log in to unmask]
Subject: Re: [TN] Solderability of nickel plating
Phil;
The MIL specs are all available free of charge at the following site:
https://assist.daps.dla.mil/quicksearch/
Keith S. Calhoun
Product Engineer
SoPark Corporation
3300 South Park Avenue
Buffalo, New York 14218
Phone: 716-822-0434 Ext. 237
Fax: 716-822-5062
email: [log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Phil Bavaro
Sent: Tuesday, September 21, 2010 1:30 PM
To: [log in to unmask]
Subject: Re: [TN] Solderability of nickel plating
ALL:
If I have a requirements to solder directly to 6051-T651 aluminum and
one of these finishes:
"Electroless Nickel Plate per AMS2404 .0005 to .0007 inch thick" or
"MIL-C-26074 Class 3 Grade B (.0005 inch thick)" or
"Electroless Nickel Plate IAW AMS2404, .001 to .0015 Inch Thick",
how will I know if I am in the low or high phosphorus category?
I am not able to access the MIL or AMS standards currently so hopefully
the answer to my question is not contained therein.
Thanks,
Phil
-----Original Message-----
From: "Glidden, Kevin" <[log in to unmask]>
Sender: TechNet <[log in to unmask]>
Date: Tue, 21 Sep 2010 08:52:39
To: <[log in to unmask]>
Reply-To: TechNet E-Mail Forum <[log in to unmask]>,
"Glidden, Kevin" <[log in to unmask]>
Subject: [TN] Solderability of nickel plating
All,
Can anyone comment on the solderability of the nickel plate,
particularly with regard to type of plating: high phosphor / low
phosphor, and also storage conditions:
I've been gathering info, and seen conflicting information.
From one article:
http://corrosion-doctors.org/MetalCoatings/Electroless.htm
A paper submitted at the Electroless Nickel conference of 1989 held in
Cincinnati Ohio, Titled "Solderability Parameters of Elecroless Nickel
Bearing Electronic Finishes" By Louis Kosarek of STB Systems, Inc.
report that "An electroless nickel deposit which contains a
concentration of phosphorus ranging from 0.1% to 3.0% is readily
solderable on an "As-plated Basis" per Mil-Std 883c method 2003. The
frequency of solderability tests which fail per Mil-Std 883c will
increase as the phosphorus content of electroless nickel alloy increases
from 3.0 to 7.0% phosphorus. A solderability test conducted per Mil-Std
883c method 2003 incorporating an as-plated surface finish containing
phosphorus in excess of 7%, the components will consistently fail. The
mode of failure is non-wetting of the surface."
This indicates low phosphorous plating is best for solderability. Many
other papers seem to agree with this.
------------------------------------------------------------------------
---------------------------------------------
From another article: http://www.pfonline.com/articles/pfd0024.html
Solderability/Weldability. An important aspect of electroless nickel to
the electronics industry is its solderability. All electroless nickel
deposits are solderable provided the soldering conditions are matched to
the condition of the particular electroless nickel deposit.
Lower-phosphorus electroless nickel is more easily solderable
immediately after plating than higher-phosphorus electroless nickel.
However, this advantage disappears after 12 - 24 hrs. At this point, the
ease of solderability depends upon the characteristics of the passive
layer that forms on the surface of the electroless nickel deposit. Those
deposits plated from baths containing heavy metal and sulfur-bearing
brighteners and stabilizers, such as most commercial low- and
mid-phosphorus electroless nickel systems, form a thicker tenacious
passive layer than those that do not, such as most high-phosphorus
electroless nickel systems. High-phosphorus electroless nickel systems
tend to be more solderable in aged deposits.
Other important factors influencing the solderability of electroless
nickel deposits include residual contamination left on the surface after
plating and storage conditions after drying. Surface contamination and
exposure to environments containing sulfur dioxide, chlorine, high
humidity and high ambient temperatures will detrimentally affect
solderability. Therefore, it is imperative that parts be thoroughly
rinsed in clean DI water, dried and stored in a cool, dry atmosphere,
preferably nitrogen.
This article indicates high phosphorous plating is best for long term
solderability, and also that parts must be stored carefully (cool, dry,
sealed, nitrogen). Other articles seem to state this is a highly stable
finish and is even used as a corrosion inhibitor.
Thanks,
Kevin Glidden
Manufacturing Engineer
Astronics Luminescent Systems Inc.<http://www.astronics.com>
4 Lucent Drive
Lebanon, NH 03766
(603) 643-7766 x3152
Please note, LSI operates on a 9/80 work schedule, and is closed on
alternating Fridays. Please click the link provided to view the days
LSI will be closed.
http://www.astronics.com/LSI/documents/2010calendar-NH.pdf
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