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August 2010

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Subject:
From:
Mickey Weiner <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Mickey Weiner <[log in to unmask]>
Date:
Wed, 11 Aug 2010 09:05:21 +0300
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Phil
Could you share the  link to Qualcomm BCC guideline doc.

Thanks

Best Regards
Mickey Weiner
972-8-9774808


On Tue, Aug 10, 2010 at 9:57 PM, Phillip Bavaro <[log in to unmask]>wrote:

> Definitely greater.
>
> BCCs have very specialized pad requirements.  You might want to review
> Qualcomm's BCC guideline document for this package.
>
> Phil
>
>
>
>
> ________________________________
> From: Loa Allen <[log in to unmask]>
> To: [log in to unmask]
> Sent: Mon, August 2, 2010 7:18:23 AM
> Subject: [TN] Bump Chip Carrier (BBC) pad geometry
>
> TechNet:
>
> http://stevezeva.homestead.com/marvell_88E1111.pdf
>
> Steve has so graciously posted a couple pages of the mfr datasheet showing
> the pad geometry of a 96-pin BCC device we are using for the first time.
>
> I'm pretty sure this has been discussed before & we didn't think we'd be
> using
> something like this so wasn't paying too much attention to the thread - and
> now I'm not able to locate it in the archives.
>
> Our question is the layout design on the fab - should the pad size be equal
> to
> or greater than the device pads?  If greater than, then by how much?
>
> Sn/Pb soldering processes are required for assembly.
>
> Any ideas or comments would be greatly appreciated.
>
> Thanks in advance,
> Loa
>
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