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Date: | Tue, 10 Aug 2010 11:57:27 -0700 |
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Definitely greater.
BCCs have very specialized pad requirements. You might want to review
Qualcomm's BCC guideline document for this package.
Phil
________________________________
From: Loa Allen <[log in to unmask]>
To: [log in to unmask]
Sent: Mon, August 2, 2010 7:18:23 AM
Subject: [TN] Bump Chip Carrier (BBC) pad geometry
TechNet:
http://stevezeva.homestead.com/marvell_88E1111.pdf
Steve has so graciously posted a couple pages of the mfr datasheet showing
the pad geometry of a 96-pin BCC device we are using for the first time.
I'm pretty sure this has been discussed before & we didn't think we'd be using
something like this so wasn't paying too much attention to the thread - and
now I'm not able to locate it in the archives.
Our question is the layout design on the fab - should the pad size be equal to
or greater than the device pads? If greater than, then by how much?
Sn/Pb soldering processes are required for assembly.
Any ideas or comments would be greatly appreciated.
Thanks in advance,
Loa
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