Hi Inge - the history of the Ni/Pd/Au plating stackup is kinda
interesting. There has been lots of industry Pd plating soldering and
wirebonding investigations during the last 50 years. The work that has
always caught my attention was the published data in the late 1980s and
early 1990s. Texas Instruments investigated the use of Ni/Pd plating as a
substitute material for component leadframe spot silver process which was
part of the component wirebonding protocol. I was told that using Ni/Pd
provided both some technical and process advantages. Texas Instruments
patented the Ni/Pd plating concept (in terms of component applications)
and then implemented the concept on their component processes. The whole
concept was almost wiped out as the price of Pd skyrocketed (4X-5X price
increases per troy ounce) for a couple of years as a couple of countries
(Russia and South Africa were the rumored conspirators) locked up their Pd
stockpiles and messed up the global market. The insanity passed and things
went back to normal. Texas Instruments amended its patent to include a
flash gold to seal off the Pd from the environment degradation (Pd is a
good catalyst material so it tended to react with some storage
environments resulting in a loss of solderability). The Pd layer is not
very thick as you can get Pd embrittlement in a similar fashion to Au
embrittlement. As Richard detailed, we are really soldering to the Ni
plating with the Pd and Au being oxidation protectors of the Ni surface.
In the early 2000s, the RoHS actions began and since Ni/Pd/Au doesn't
create tin whiskers, life suddenly became very good for the surface
finish. Additionally, the industry interest in ENEPIG is another extension
of the industry assessing Pd, in combination with Ni and Au, for both
soldering and wirebonding characteristics. It appears that the industry
fascination with Pd is going to be a topic of interest for quite some
time.
Dave
Inge <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
08/25/2010 11:01 AM
Please respond to
Inge <[log in to unmask]>
To
[log in to unmask]
cc
Subject
Re: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT PARTS
Dave,
What's the idea with mixing Nickel and Palladium on component leads? In
general, Pd is used as a substitute for Rhodium in order to increase the
wear resistance for e.g. sliding contacts. I have also seen that mixing
Ni
an Pd causes an increase of the internal stress, rather much, depending
on
the wt%. What pays for the extra process in this case?
/Inge
--------------------------------------------------
From: "David D. Hillman" <[log in to unmask]>
Sent: den 25 August 2010 00:21
To: <[log in to unmask]>
Subject: Re: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT
PARTS
> Hi! Yes, I made the assumption that Jon really meant Pd and not Pt as I
> haven't run into a NiPtAu surface finish on components yet.
>
> Dave
>
>
>
> "Stadem, Richard D." <[log in to unmask]>
> 08/24/2010 04:54 PM
>
> To
> TechNet E-Mail Forum <[log in to unmask]>, "[log in to unmask]"
> <[log in to unmask]>, "Roberts, Jon (SA-1)"
> <[log in to unmask]>
> cc
>
> Subject
> RE: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT PARTS
>
>
>
>
>
>
> Well, jeez, Dave. You beat me to it again. Except I was busy trying to
> find my references to soldering with platinum, not palladium.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
> Sent: Tuesday, August 24, 2010 4:13 PM
> To: [log in to unmask]
> Subject: Re: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT
> PARTS
>
> Hi Jon! There are a couple things to remember when dealing with NiPdAu
> surface finishes: 1) Pd diffuses very slowly into a tin/lead solder
alloy.
>
> You may need to add a few seconds to your soldering process cycle time;
2)
>
> Adding an additional 5-10C of temperature will assist in the Pd
diffusion
> into the tin/lead solder alloy. You may need to increase your soldering
> temperature depending on which soldering process you are using; 3) Some
> flux material are not compatible with Pd materials. You may want to try
a
> different flux to see if you get an improved reaction; 4) Run a
> solderability test per IPC JSTD 002 to make sure you have an acceptable
> NiPdAu surface finish. When Texas Instruments first introduced the
NiPdAu
> surface finish, we had to make slight time/temperature/flux adjustments
on
>
> our typical soldering processes to obtain our expected soldering
results.
> Good Luck.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
>
>
> "Roberts, Jon (SA-1)" <[log in to unmask]>
> Sent by: TechNet <[log in to unmask]>
> 08/24/2010 12:41 PM
> Please respond to
> TechNet E-Mail Forum <[log in to unmask]>; Please respond to
> "Roberts, Jon (SA-1)" <[log in to unmask]>
>
>
> To
> [log in to unmask]
> cc
>
> Subject
> [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT PARTS
>
>
>
>
>
>
> Have any of you experience difficulty in producing an acceptable solder
> joint with Nickel platinum gold SMT lead finishes? We can rework at
> least twice to achieve an acceptable condition. Lead free part but we
> use a solder with lead. Any help is appreciated. Jon
>
>
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