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Wed, 25 Aug 2010 18:06:34 +0200
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ICEE

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From: "Bev Christian" <[log in to unmask]>
Sent: den 25 August 2010 18:03
To: <[log in to unmask]>
Subject: Re: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT PARTS

> Inge,
> They are not mixed. They are sequential layers.
> Bev
> RIM
>
> ----- Original Message -----
> From: Inge [mailto:[log in to unmask]]
> Sent: Wednesday, August 25, 2010 12:01 PM
> To: [log in to unmask] <[log in to unmask]>
> Subject: Re: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT 
> PARTS
>
> Dave,
>
> What's the idea with mixing Nickel and Palladium on component leads? In
> general, Pd is used as a substitute for Rhodium in order to increase the
> wear resistance for e.g. sliding contacts.  I have also seen that mixing 
> Ni
> an Pd causes an increase of  the internal stress, rather much, depending 
> on
> the wt%. What pays for the extra process in this case?
> /Inge
>
>
>
> --------------------------------------------------
> From: "David D. Hillman" <[log in to unmask]>
> Sent: den 25 August 2010 00:21
> To: <[log in to unmask]>
> Subject: Re: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT 
> PARTS
>
>> Hi! Yes, I made the assumption that Jon really meant Pd and not Pt as I
>> haven't  run into a NiPtAu surface finish on components yet.
>>
>> Dave
>>
>>
>>
>> "Stadem, Richard D." <[log in to unmask]>
>> 08/24/2010 04:54 PM
>>
>> To
>> TechNet E-Mail Forum <[log in to unmask]>, "[log in to unmask]"
>> <[log in to unmask]>, "Roberts, Jon (SA-1)"
>> <[log in to unmask]>
>> cc
>>
>> Subject
>> RE: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT PARTS
>>
>>
>>
>>
>>
>>
>> Well, jeez, Dave. You beat me to it again. Except I was busy trying to
>> find my references to soldering with platinum, not palladium.
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
>> Sent: Tuesday, August 24, 2010 4:13 PM
>> To: [log in to unmask]
>> Subject: Re: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT
>> PARTS
>>
>> Hi Jon! There are a couple things to remember when dealing with NiPdAu
>> surface finishes: 1) Pd diffuses very slowly into a tin/lead solder 
>> alloy.
>>
>> You may need to add a few seconds to your soldering process cycle time; 
>> 2)
>>
>> Adding an additional 5-10C of temperature will assist in the Pd diffusion
>> into the tin/lead solder alloy. You may need to increase your soldering
>> temperature depending on which soldering process  you are using; 3) Some
>> flux material are not compatible with Pd materials. You may want to try a
>> different flux to see if you get an improved reaction; 4) Run a
>> solderability test per IPC JSTD 002 to make sure you have an acceptable
>> NiPdAu surface finish. When Texas Instruments first introduced the NiPdAu
>> surface finish, we had to make slight time/temperature/flux adjustments 
>> on
>>
>> our typical soldering processes to obtain our expected soldering results.
>> Good Luck.
>>
>> Dave Hillman
>> Rockwell Collins
>> [log in to unmask]
>>
>>
>>
>>
>> "Roberts, Jon (SA-1)" <[log in to unmask]>
>> Sent by: TechNet <[log in to unmask]>
>> 08/24/2010 12:41 PM
>> Please respond to
>> TechNet E-Mail Forum <[log in to unmask]>; Please respond to
>> "Roberts, Jon (SA-1)" <[log in to unmask]>
>>
>>
>> To
>> [log in to unmask]
>> cc
>>
>> Subject
>> [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT PARTS
>>
>>
>>
>>
>>
>>
>> Have any of you experience difficulty in producing an acceptable solder
>> joint with Nickel platinum gold SMT lead finishes?  We can rework at
>> least twice to achieve an acceptable condition.  Lead free part but we
>> use a solder with lead.  Any help is appreciated.  Jon
>>
>>
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