Dave,

What's the idea with mixing Nickel and Palladium on component leads? In 
general, Pd is used as a substitute for Rhodium in order to increase the 
wear resistance for e.g. sliding contacts.  I have also seen that mixing Ni 
an Pd causes an increase of  the internal stress, rather much, depending on 
the wt%. What pays for the extra process in this case?
/Inge



--------------------------------------------------
From: "David D. Hillman" <[log in to unmask]>
Sent: den 25 August 2010 00:21
To: <[log in to unmask]>
Subject: Re: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT PARTS

> Hi! Yes, I made the assumption that Jon really meant Pd and not Pt as I
> haven't  run into a NiPtAu surface finish on components yet.
>
> Dave
>
>
>
> "Stadem, Richard D." <[log in to unmask]>
> 08/24/2010 04:54 PM
>
> To
> TechNet E-Mail Forum <[log in to unmask]>, "[log in to unmask]"
> <[log in to unmask]>, "Roberts, Jon (SA-1)"
> <[log in to unmask]>
> cc
>
> Subject
> RE: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT PARTS
>
>
>
>
>
>
> Well, jeez, Dave. You beat me to it again. Except I was busy trying to
> find my references to soldering with platinum, not palladium.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
> Sent: Tuesday, August 24, 2010 4:13 PM
> To: [log in to unmask]
> Subject: Re: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT
> PARTS
>
> Hi Jon! There are a couple things to remember when dealing with NiPdAu
> surface finishes: 1) Pd diffuses very slowly into a tin/lead solder alloy.
>
> You may need to add a few seconds to your soldering process cycle time; 2)
>
> Adding an additional 5-10C of temperature will assist in the Pd diffusion
> into the tin/lead solder alloy. You may need to increase your soldering
> temperature depending on which soldering process  you are using; 3) Some
> flux material are not compatible with Pd materials. You may want to try a
> different flux to see if you get an improved reaction; 4) Run a
> solderability test per IPC JSTD 002 to make sure you have an acceptable
> NiPdAu surface finish. When Texas Instruments first introduced the NiPdAu
> surface finish, we had to make slight time/temperature/flux adjustments on
>
> our typical soldering processes to obtain our expected soldering results.
> Good Luck.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
>
>
> "Roberts, Jon (SA-1)" <[log in to unmask]>
> Sent by: TechNet <[log in to unmask]>
> 08/24/2010 12:41 PM
> Please respond to
> TechNet E-Mail Forum <[log in to unmask]>; Please respond to
> "Roberts, Jon (SA-1)" <[log in to unmask]>
>
>
> To
> [log in to unmask]
> cc
>
> Subject
> [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT PARTS
>
>
>
>
>
>
> Have any of you experience difficulty in producing an acceptable solder
> joint with Nickel platinum gold SMT lead finishes?  We can rework at
> least twice to achieve an acceptable condition.  Lead free part but we
> use a solder with lead.  Any help is appreciated.  Jon
>
>
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