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August 2010

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From:
"Roberts, Jon (SA-1)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Roberts, Jon (SA-1)
Date:
Wed, 25 Aug 2010 10:21:10 -0500
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Guy, is conveyor speed that needs to be look at to see if the flux is
being properly activated and not too early or too late?  And how would
you actually know that? Any tests that can be done?  Doing an analysis
of the flux residue on a test board?  You peak my curiosity, Thanks, Jon

 

-----Original Message-----
From: Guy Ramsey [mailto:[log in to unmask]] 
Sent: Wednesday, August 25, 2010 9:33 AM
To: 'TechNet E-Mail Forum'; Roberts, Jon (SA-1)
Subject: RE: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT
PARTS

I didn't reply because I had never seen that finish. 
But, Pd yes, and yes I agree with Dave with one proviso.
Make sure you are not driving all the flux off too early. 
Then you get joints that look like the profile is too cool when in fact
it
is too slow, increasing temp only makes it worse. 

Guy

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Roberts, Jon (SA-1)
Sent: Wednesday, August 25, 2010 10:20 AM
To: [log in to unmask]
Subject: Re: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT
PARTS

Dave Hillman assumed correctly. I had in the subject matter, just goof
trying to type the Pd.  Middle finger was too slow and let my index
finger take over.  Are you in agreement with Dave Hillman response?
Little more information related to the issue:

	This affects several SMT OPA part numbers with the same finish.
	Have some in stockroom for over 3 years, so cannot send back to
vendor.
	Have to use an RMA No Clean type flux (ROL0) (We clean).

I have provided recommendation to those working the corrective action
that was issued to manufacturing. 

Those included:

	1. Sending a sample to have the analyses both for any
contamination and solderability. We could perform the second one here
but I recommended an 	   outside lab due it.
	2. Measure the lead temperature during a reflow cycle.
	3. Measure the lead temperature during the hand solder process
that uses a soldering iron and liquid RMA No Clean flux (ROL0).
	4. Send the necessary quantity from stock prior to the next
build to have pre-tinned and at that time the source we use can use a
stronger flux, if 	   necessary and are able to clean properly
prior to putting back on tape and reel.

Also we have had this issue several times before and the solution was to
rework/replace the parts but it was in smaller lot sizes.  Now it is
larger lot sizes being processed and affected.

Again I thank those on IPC TechNet and their expertise.  Jon
 


-----Original Message-----
From: Stadem, Richard D. [mailto:[log in to unmask]] 
Sent: Tuesday, August 24, 2010 4:55 PM
To: TechNet E-Mail Forum; [log in to unmask]; Roberts, Jon
(SA-1)
Subject: RE: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT
PARTS

Well, jeez, Dave. You beat me to it again. Except I was busy trying to
find my references to soldering with platinum, not palladium.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Tuesday, August 24, 2010 4:13 PM
To: [log in to unmask]
Subject: Re: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT
PARTS

Hi Jon! There are a couple things to remember when dealing with NiPdAu 
surface finishes: 1) Pd diffuses very slowly into a tin/lead solder
alloy. 
You may need to add a few seconds to your soldering process cycle time;
2) 
Adding an additional 5-10C of temperature will assist in the Pd
diffusion 
into the tin/lead solder alloy. You may need to increase your soldering 
temperature depending on which soldering process  you are using; 3) Some

flux material are not compatible with Pd materials. You may want to try
a 
different flux to see if you get an improved reaction; 4) Run a 
solderability test per IPC JSTD 002 to make sure you have an acceptable 
NiPdAu surface finish. When Texas Instruments first introduced the
NiPdAu 
surface finish, we had to make slight time/temperature/flux adjustments
on 
our typical soldering processes to obtain our expected soldering
results. 
Good Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]




"Roberts, Jon (SA-1)" <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
08/24/2010 12:41 PM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
"Roberts, Jon (SA-1)" <[log in to unmask]>


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Subject
[TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT PARTS






 Have any of you experience difficulty in producing an acceptable solder
joint with Nickel platinum gold SMT lead finishes?  We can rework at
least twice to achieve an acceptable condition.  Lead free part but we
use a solder with lead.  Any help is appreciated.  Jon


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