Thanks, everyone. It is NOT being done, but it were to be done it would partially be a result of not having ready access to the component, but only through a few holes in an expletive deleted metal RF can.
Bev
RIM
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Thayer, Wayne - IIW
Sent: Monday, August 23, 2010 1:47 PM
To: [log in to unmask]
Subject: Re: [TN] Double underfill
Hi Bev-
There is no good reason for double underfill. It means they messed up the first application, and once that happens, you have scrap.
The first area of concern is incomplete underfill. If you already underfilled a BGA from two sides, then how could you possibly complete the process by adding more underfill? It will entrap voids. Maybe you could develop a vacuum assisted process which could fix that.
The next area of concern is sticking to cured underfill: Most underfills won't stick to the cured product--although with some research, you may be able to develop a process for that.
So while it may be possible to develop a process for salvaging the scrap these guys made, it will be expensive to prove it works.
I will rework nearly anything, but last month even I scrapped a run due to incomplete underfill.
Wayne
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Monday, August 23, 2010 11:19 AM
To: [log in to unmask]
Subject: [TN] Double underfill
Technetters,
I would like your opinions on a theoretical underfill situation. What would be your comments be if a process group told you that they had underfilled a component and it was cured and they wanted to add more underfill to the component?
Bev
RIM
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