Underfilling is generally on two sometimes 3 sides of a component which allows the material to wick through with minimal void formation.  Doing it again may cause unacceptable voids. Maybe they need to start again with more material volume?

Bev Christian <[log in to unmask]> wrote:

>Technetters,
>I would like your opinions on a theoretical underfill situation.  What would be your comments be if a process group told you that they had underfilled a component and it was cured and they wanted to add more underfill to the component?
>Bev
>RIM
>
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