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August 2010

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Subject:
From:
Steven Creswick <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steven Creswick <[log in to unmask]>
Date:
Mon, 23 Aug 2010 12:25:03 -0400
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Bev,

Must be the first attempt did not form a complete fillet around the
perimeter [big oops]? or are they planning to drill a hole from underneath?
Could leave yourself open for air entrapment/non-fill.
I would likely 'okay' a handfull for testing purposes, but would demand a
pound of flesh before considering larger quantities - subject to cure
conditions, other components, cost of assy, etc.

Steve C
On Mon, Aug 23, 2010 at 11:19 AM, Bev Christian <[log in to unmask]> wrote:

> Technetters,
> I would like your opinions on a theoretical underfill situation.  What
> would be your comments be if a process group told you that they had
> underfilled a component and it was cured and they wanted to add more
> underfill to the component?
> Bev
> RIM
>
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