Not to be anti-semantic, but the mere fact that they want to add more
material means the component has already met the requirement for being
under filled. More attempts at under filling will be a never ending
process. 
Once they have established that an acceptable under fill process has
been achieved, then they need to define requirements for the application
of additional fill material to meet the new acceptance criteria. I would
be very wary of this.
Dewey 




From:   Bev Christian <[log in to unmask]>
To:     [log in to unmask]
Date:   08/23/2010 11:19 AM
Subject:        [TN] Double underfill
Sent by:        TechNet <[log in to unmask]>



Technetters,
I would like your opinions on a theoretical underfill situation.  What 
would be your comments be if a process group told you that they had 
underfilled a component and it was cured and they wanted to add more 
underfill to the component?
Bev
RIM

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