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August 2010

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Thu, 19 Aug 2010 11:01:07 -0400
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Qfn vendor usually tell you what thickness of stencil to use with what size of opening.  How was that recommendation compare to your design?
--------------------------
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----- Original Message -----
From: Roger Mack [mailto:[log in to unmask]]
Sent: Thursday, August 19, 2010 10:51 AM
To: [log in to unmask] <[log in to unmask]>
Subject: Re: [TN] Bulging solder on the sides of QFP leads

Have you measured the actual pad widths? If your design has a 20mil pitch 
part with 10mil pads, you will likely have a much narrower pad at the 
surface on a 3 oz. board. If your stencil design was for a 10mil pad you 
may have poor gasketing and be depositting more paste than you intended 
to. 


Roger Mack  P.Eng. 
Manufacturing Specialist
Parker Hannifin Electronic Controls
Electronic Controls Division
1305 Clarence Avenue
Winnipeg, MB  R3T 1T4 Canada 
direct 204 453 3339 x373
[log in to unmask]
www.parker.com/ecd







Ioan Tempea <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
08-19-2010 08:34
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Ioan Tempea <[log in to unmask]>


To
[log in to unmask]
cc

Subject
Re: [TN] Bulging solder on the sides of QFP leads






Thanks again!

To get back a bit to Steve's observation: the boards indeed have 2 layers 
of soldermask. But it has 3oz of Cu on all the layers.

Would it be necessary to have 2 layers of SM, just because of the 
thickness of the traces?
If not, why would one lay down extra SM?

Thanks,

Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] 
W | www.digico.cc

N'imprimer que si nécessaire - Print only if you must


-----Message d'origine-----
De : Guy Ramsey [mailto:[log in to unmask]] 
Envoyé : August-19-10 9:26 AM
À : [log in to unmask]
Objet : Re: [TN] Bulging solder on the sides of QFP leads

No, I would not consider it a defect, given the information you have
provided. 

IMHO, it is better to optimize toward excess solder than insufficient. 

Solder shorts are obvious and easy to troubleshoot, compared to
troubleshooting an intermittent insufficient solder joint.

Guy


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