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August 2010

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Subject:
From:
Ioan Tempea <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ioan Tempea <[log in to unmask]>
Date:
Thu, 19 Aug 2010 09:34:49 -0400
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Thanks again!

To get back a bit to Steve's observation: the boards indeed have 2 layers of soldermask. But it has 3oz of Cu on all the layers.

Would it be necessary to have 2 layers of SM, just because of the thickness of the traces?
If not, why would one lay down extra SM?

Thanks,

Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] 
W | www.digico.cc

N'imprimer que si nécessaire - Print only if you must


-----Message d'origine-----
De : Guy Ramsey [mailto:[log in to unmask]] 
Envoyé : August-19-10 9:26 AM
À : [log in to unmask]
Objet : Re: [TN] Bulging solder on the sides of QFP leads

No, I would not consider it a defect, given the information you have
provided. 

IMHO, it is better to optimize toward excess solder than insufficient. 

Solder shorts are obvious and easy to troubleshoot, compared to
troubleshooting an intermittent insufficient solder joint.

Guy


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