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August 2010

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From:
Stewart McCracken <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stewart McCracken <[log in to unmask]>
Date:
Thu, 19 Aug 2010 08:23:27 +0000
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Hi Chris,

I guess that you've maybe considered direct material analysis already, but my thoughts, if budget allows as follows...

What size is the inclusion? You might consider a direct material analysis if big enough? May be that you can get a signature element which is detectable in EDX which could distinguish between the materials? If not, micro-ATR with the FT-IR can potentially get you down to a sample size of around 5 microns (albeit downhill with a following wind...). If neither of those applicable, XPS should be able to separate. 

Kind regards,

Stewart

Stewart McCracken
MCS Ltd.
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Chris Mahanna
Sent: 18 August 2010 17:16
To: [log in to unmask]
Subject: [TN] resist or adhesive?

I have a customer who is asking me to come up with a test-

To prove with a high degree of certainty whether debris that is encapsulated in a hole-wall plating nodule (which is now ground/polished open in a section) is resist, polyimide flex, or acrylic coverlay adhesive.

I said: "well it is translucent, and it isn't blue".  IMO it is almost certainly the acrylic adhesive.

Could I put the mount in a bath of resist strip and see if the inclusions dissolve?

Chris Mahanna
Robisan Lab

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