TechNet:

http://stevezeva.homestead.com/marvell_88E1111.pdf

Steve has so graciously posted a couple pages of the mfr datasheet showing 
the pad geometry of a 96-pin BCC device we are using for the first time.

I'm pretty sure this has been discussed before & we didn't think we'd be using 
something like this so wasn't paying too much attention to the thread - and 
now I'm not able to locate it in the archives.

Our question is the layout design on the fab - should the pad size be equal to 
or greater than the device pads?  If greater than, then by how much?

Sn/Pb soldering processes are required for assembly.

Any ideas or comments would be greatly appreciated.

Thanks in advance,
Loa

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