Hi Ioan - you might reduce the solder print volume slightly to reduce the 
bulge. As Leland detailed, if the bulge does not cause any workmanship 
inspection or functional issues, it would not be considered a problem.

Dave Hillman
Rockwell Collins
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Ioan Tempea <[log in to unmask]> 
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08/18/2010 09:36 AM
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Re: [TN] Bulging solder on the sides of QFP leads






20 mil pitch, 10 mil wide and 5 mils longer than pad length apertures, 6 
mil stencil

 

Thanks,

 

Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] <mailto:[log in to unmask]> 
W | www.digico.cc <http://www.digico.cc/> 

 
 N'imprimer que si nécessaire - Print only if you must

 

De : [log in to unmask] [mailto:[log in to unmask]] 
Envoyé : August-18-10 10:32 AM
À : TechNet E-Mail Forum; Ioan Tempea
Cc : [log in to unmask]
Objet : Re: [TN] Bulging solder on the sides of QFP leads

 


Hi Ioan - what stencil thickness did you use and what stencil aperture 
scheme did you use? 

Dave Hillman 
Rockwell Collins 
[log in to unmask] 



Ioan Tempea <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]> 

08/18/2010 09:27 AM 

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[TN] Bulging solder on the sides of QFP leads

 

 




Dear Technos,



Please see the gallery http://ipc-technet.groupsite.com/gallery/14996



There seems to be an excess of solder, hence the bulging aspect of the 
joints along the pins. Can there be any issue with this? IPC-A-610 does 
not seem to be concerned with this situation, as long as the minimal 
electrical clearance is not violated, and it's not.



Thanks,



Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] <mailto:[log in to unmask]> 
W | www.digico.cc <http://www.digico.cc/> 


N'imprimer que si nécessaire - Print only if you must




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