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Date: | Wed, 18 Aug 2010 10:02:55 -0500 |
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Thank you everyone for your comments on the plasma. I am working some of
it into our periodic maintenance procedures for the equipment.
Steve hit the nail on the head. We had been processing this assembly for
months with no problem until this incident. The assembly did in fact
bridge the two shelves. In the past, the upper surface of the highest
bracket had been covered with an insulating polyimide tape. The one that
got fried did not have the tape present. Got some neat pictures though.
When we order a plasma chamber for production, we will have to make sure
that the electrode/shelf spacings are large enough for the tallest
assembly, plus a scosh or two.
This is a fantastic forum.
OK Dewey, expecting something spectacular here.....
Doug Pauls
Steven Creswick <[log in to unmask]>
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08/16/2010 11:16 AM
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Re: [TN] plasma question
Doug,
Could the board inadvertantly have shorted out the electrodes of the
chamber? With some chambers this is quite easy to do if you have large
objects going inside.
My assumption is that you are merely freshening up the surfaces by ...
atomic level ablation and not blasting off copper, etc.
Steve C
On Mon, Aug 16, 2010 at 9:07 AM, Douglas Pauls
<[log in to unmask]>wrote:
> Good morning all,
> For those of you who have used plasma etching on circuit assemblies, I
> have a question. One of our operators observed "sparking" through the
> plasma chamber viewport and a transistor was fried. Any idea what
causes
> this? First time we have seen this.
>
> Doug Pauls
>
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