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Date: | Wed, 18 Aug 2010 09:31:32 -0500 |
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Hi Ioan - what stencil thickness did you use and what stencil aperture
scheme did you use?
Dave Hillman
Rockwell Collins
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Ioan Tempea <[log in to unmask]>
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08/18/2010 09:27 AM
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[TN] Bulging solder on the sides of QFP leads
Dear Technos,
Please see the gallery http://ipc-technet.groupsite.com/gallery/14996
There seems to be an excess of solder, hence the bulging aspect of the
joints along the pins. Can there be any issue with this? IPC-A-610 does
not seem to be concerned with this situation, as long as the minimal
electrical clearance is not violated, and it's not.
Thanks,
Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
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W | www.digico.cc <http://www.digico.cc/>
N'imprimer que si nécessaire - Print only if you must
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