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August 2010

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From:
"David D. Hillman" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 23 Aug 2010 11:42:51 -0500
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Hi Bev - the process you describe is underfill dependent - some underfills 
will bond to themselves and other not so much. You need to conduct some 
simple testing to obtain the answer. We have one underfill you can conduct 
the double underfill process and one underfill that doesn't work. After 
you answer that portion of the question, then you can determine just what 
level of voiding you can fill.

Dave Hillman
Rockwell Collins
[log in to unmask]




Bev Christian <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
08/23/2010 10:19 AM
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TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Bev Christian <[log in to unmask]>


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Subject
[TN] Double underfill






Technetters,
I would like your opinions on a theoretical underfill situation.  What 
would be your comments be if a process group told you that they had 
underfilled a component and it was cured and they wanted to add more 
underfill to the component?
Bev
RIM

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